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EUV

  • Rigorous OPC and Source Optimization (presentation)
  • Embedded Multilayer Mirror Defects (download a recent presentation)
    • Arbitrary Defect Geometry (video)
    • Inspect-ability
    • Print-ability
  • Off-axis Shadowing Effects, H-V bias (including Non-Constant Scattering Coefficients)
  • Absorber Stack Analysis (EM-Stack video)
  • Absorber Profile (sidewall & corner rounding) (video)
  • Absorber Defects
  • OPC for EUV (small area)
  • Multilayer Mirror Structure (PSM)

Double Patterning

  • Litho-Etch Litho-Etch
  • Litho-Freeze Litho-Etch
  • Sidewall Spacer
  • Wafer topography effects (video)
    • Non-planar resist
    • Underlying features from 1st exposure

ArF/Immersion

Phase Shift Masks

  • Alternating PSM: Intensity imbalance between shifed and unshifted openings
  • Phase defects
  • Wet etch/dual-trenching
  • Chromeless Phase Lithography
  • Attenuated Phase Shift Masks

Resist

  • NTD with deprotection-shrinkage (presentation)
  • SEM-induced shrinkage
  • Stochastic effects at EUV & DUV
  • PEB Diffusion Effects
  • Surface Inhibition
  • Temperature Effects
  • Sidewall analysis
  • Inner-Outer corner bias analysis
  • Pull-back
  • Top-loss

DUV Binary Masks

  • OPC Verification
  • Line-end shortening
  • Iso-dense bias

GDS-II/Layout

  • Rigorous/Scalar model-based OPC of small area
  • Bias, Round, Manhattanize, Combine and Clip operations
  • Import geometry
  • Convert 2D pattern to 3D mask

Film Stack Analysis

  • BARC Optimization
  • Multilayer Mirror Reflectivity
  • Resist thickness effects

Other

  • Alignment Mark Simulation (presentation)
  • Mask Inspection
  • Wafer Inspection
  • Scatterometry
  • Grating Analysis (1D & 2D)
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