- Embedded Multilayer Mirror Defects (download a recent presentation
- Arbitrary Defect Geometry (video)
- Inspect-ability
- Print-ability
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- Off-axis Shadowing Effects, H-V bias (including Non-Constant Scattering Coefficients)
- Absorber Stack Analysis (EM-Stack video)
- Absorber Profile (sidewall & corner rounding) (video)
- Absorber Defects
- OPC for EUV (small area)
- Multilayer Mirror Structure (PSM)
- polarization effects
- high-index immersion lithography
- immersion bubble
- PEB Diffusion Effects
- Surface Inhibition
- Temperature Effects
- Sidewall analysis
- Inner-Outer corner bias analysis
- CALPM, Full-physics, Diffused Image models
- EUV & DUV resists
- Rigorous/Scalar model-based OPC of small area
- Bias, Round, Manhattanize, Combine and Clip operations
- Import geometry
- Convert 2D pattern to 3D mask
- Double Exposure
- Mask Inspection
- Wafer Inspection
- Scatterometry
- Grating Analysis (1D & 2D)
- Laser Spectral Bandwidth (video)
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- Litho-Etch Litho-Etch
- Litho-Freeze Litho-Etch
- Sidewall Spacer
- Wafer topography effects (video)
- Non-planar resist
- Underlying features from 1st exposure
- Alternating PSM: Intensity imbalance between shifed and unshifted openings
- Phase defects
- Wet etch/dual-trenching
- Chromeless Phase Lithography
- Attenuated Phase Shift Masks
- OPC Verification
- Line-end shortening
- Iso-dense bias
- BARC Optimization
- Multilayer Mirror Reflectivity
- Resist thickness effects
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